Plasma treatment of PCBs prior to potting increases the adhesion of the potting compound to the PCB and surrounding housing which in turn increases reliability and reduces failure rates due to moisture and corrosive agents.
Plasma treatment to improve potting compound adhesion may be applied as a fully conformal batch or in-line process depending on the manufacturing set-up. The plasma is potential free and does not have any adverse effects on sensitive electronic components. We also offer a wide range of surface test methods for comparison of pre- and post-plasma treated parts.
Plasma Treatment for Potting Compound Adhesion
- Localised, in-line atmospheric plasma activation
- Conformal activation batch-processed parts
- Potential-free process for sensitive components
- No problems with temperature-sensitive materials
