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Press Releases

Plasma Treatment for Wire Bond Improvement

Henniker Plasma, a leading manufacturer of plasma surface treatment equipment, presents the latest and most reliable solutions for reducing wire bonding failures.

Wire bonding is a technique used when creating electrical interconnections between semiconductors, integrated circuits and silicon chips using fine wires. These delicate wires carry the information to the electronic chip.  If they fail, the effectiveness of the interconnections between the electronic parts become compromised. Wire bond failure is a major concern for many semiconductor and electronics manufacturers.

 henniker plasma invests in extending surface chemistry analysis capabilities press release

 Wire bonded silicon chip

Plasma cleaning is regarded as something of an industry standard for wire bonding, efficiently removing organic contaminants and thin oxide layers under high throughput conditions, quickly, efficiently, and reproducibly, greatly enhancing yield and reducing bond failures.

Read our full Press Release here for more information on wire bonding and plasma technology.

Click here to download the full Press Release

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    Simon Baxter - BAE Systems, MAI

    BAE
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    Dr Ravi Desai - Making Lab, Francis Crick Institute

    Francis Crick Institute
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    Dr Panagiotis Manesiotis BSc MRSC - Queen’s University Belfast

    Queens Uni Belfast
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    Tom Doak - Trak Microwave

    Queens Uni Belfast
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