Henniker Plasma, presents the latest and most reliable solutions for reducing wire bonding failures.
Wire bonded silicon chip
Wire bonding is a technique used when creating electrical interconnections between semiconductors, integrated circuits and silicon chips using fine wires. These delicate wires carry the information to the electronic chip. If they fail, the effectiveness of the interconnections between the electronic parts become compromised. Wire bond failure is a major concern for many semiconductor and electronics manufacturers.
Presence of Contamination is a Common Cause of Wire Bonding Failure
Bond Pad Contamination
Wire bond failure can occur when the fine wire bonds are unable to connect efficiently to a bond pad. Halogen and silicone contamination can cause corrosion and impede adhesion. The formation of corrosion by-products can also become damaging, especially if present at the time of bonding.